中正大學課程大綱
Fundamental Mechanics of Electronic Packaging電子封裝力學概論
一、課程概述
Prerequisites or Prerequisites:
General Physics, Material Mechanics, Engineering Materials

Course Overview: The major education goal is the introduction on development roadmap of electronic packaging technology, and related mechanical reliability issues with analysis methods. Moreover, the testing standard of electronic packaging is also introduced to train the fundamental theories and analysis ability of students.
二、課程大綱說明文件電子封裝力學概論-黃北辰.pdf
三、教材編選
四、教學教法
五、評量工具
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