This course primarily focuses on the reliability and mechanical analysis of electronic packaging. It covers the performance and reliability assessment of electronic components under various environmental conditions, along with the application of relevant mechanical concepts and tools in electronic packaging design. Students will learn to analyze and evaluate the reliability of packaging designs, exploring the impact of material properties, mechanical structures, thermal characteristics, and environmental factors on packaging reliability. The course may encompass failure analysis, simulation techniques, reliability testing methods, as well as strategies and technologies to enhance packaging reliability. Through theoretical knowledge and real case studies, students will gain a comprehensive understanding of the core concepts and practical applications of electronic packaging reliability and mechanical analysis.