本課程將介紹半導體元件的製程原理和技術。在本課程中，將詳細介紹積體電路之發展和製程的介紹。由於商業用電子元件(包含手機、車用晶片、軍事用電子元件)的大量需求，加上全球電腦和網絡建設的推進以及普及，半導體產業之發展也隨時代的推演而更加蓬勃。其中，半導體之製程更是這些元件的發展基礎。為此，本課程將提供學生針對半導體元件製程技術的相關元件設計之知識以及必備的製程技術。此外，學生將在學期末進行口頭報告。
This course will introduce the process principles and technologies of semiconductor components. In this course, the development and process of integrated circuits will be introduced in detail. Due to the large demand for commercial electronic components (including mobile phones, automotive chips, and military electronic components), coupled with the promotion and popularization of global computer and network construction, the development of the semiconductor industry has also become more vigorous with the deduction of the times. Among them, the semiconductor manufacturing process is the basis for the development of these components. To this end, this course will provide students with the knowledge of related component design and necessary process technology for semiconductor component process technology. In addition, students will give an oral presentation at the end of the semester.
目標：
學生將學習半導體元件的製程原理和技術以及半導體產業及相關材料的發展，包括元件製程、遮罩、蝕刻技術以及電晶體等電子元件的工作機制。
Students will learn the process principles and technologies of semiconductor components and the development of semiconductor industry and related materials, including component process, masking, etching technology and the working mechanism of electronic components such as transistors.